Range of products

WB300 - Wafer Balling Station

01 - Main Unit

for Wafers (≤ 12 inch / 300 mm) and BGA's / CSP's

02 - Optical Unit

optional

03 - Precision Measuring Bridge

optional

04 - Desk

optional

05 - Foot Switch

optional

06 - Lamp

optional

07 - Vacuum Plate

optional

PB46 - Printing & Balling Station
Wafer Carrier 12" - 13 Slot
Wafer Carrier 6" - 13 Slot
Wafer Carrier 6" - 25 Slot
Wafer Carrier 8" - 13 Slot
Wafer Carrier 8" - 25 Slot
Wafer Transfer Station
Waferframe Magazine

WB300 - Wafer & BGA / CSP Balling

substrates: Wafer, BGA / CSP

applications: research and development, volume production

substrate size: ≤ 12 inch / 300 mm

sphere size: 250 µm - 760 µm (200 µm optional)

throughput: ≥ 20 substrates / hour

yield: 99.998 (tested at Fraunhofer ISIT)

pattern change: ≤ 10 min.

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